Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components.
We develop cost effective advanced interconnect technology for high density and high performance applications. Our patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow’s through silicon via technology. We enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.
» Smallest Form-Factor, Highest Density Solution on the Market: a true Stacked-WLCSP® solution.
» Low Cost Structure (Minimalist/Parallel Process Approach): Opportunity to play in both Consumer and High-End Markets.
» Scalable Solution: Designed to scale to Limitless Die-Count (100+ Die Demonstrated) and 2G+ Signal Speeds.
» Ease of Adoption/Integration: Technology has been Designed to Integrate Easily into Traditional Back-End Manufacturing
» Proven Reliability & Solution for KGD.
» Powerful Intellectual Property.
» Experienced Team (Leadership & Engineering) with a Recognized Track Record of Successful Commercial Product Launch.
US Sales:831.438.3887 x132Vertical Circuits Inc. - USA 10 Victor Square Scotts Valley, CA 95066 |
International Sales:+886-938-637377Vertical Circuits Taiwan 5 Fl., No. 547, SaMing Rd. Chubei, ShinChu Taiwan jeff.lin@verticalcircuits.com |
