Jetting Your Way to Fine-pitch 3D Interconnects

November 16, 2010

Optomec and Vertical Circuits Partner to Develop Ultra-Fine Pitch 3D Interconnect Solution

Albuquerque, New Mexico    July 9, 2009

Vertical Circuits Inc. announces the addition of Bill Watkins and David Savage to its Board of Directors.

SCOTTS VALLEY, CA    March 10, 2009

Micronews Issue 77 - Vertical Circuits & Disco partner to enable high density 3D packaging solution

February 26, 2009

3D Wafer Level Packages for Memory and Image Sensor Applications

Chip Scale Review, January 2009    February 5, 2009

Vertical Circuits and DISCO Corporation Partner to Enable High Density 3D Packaging Solution

Scotts Valley, CA    January 28, 2009

Advancing Microelectronics

November/December 2008    December 30, 2008

Advanced Packaging Magazine, September Issue on Thin, Strong, Cheap: Improving 3D Chip Properties SEMICON West 2008 in Review Exhibitor Spotlight, Page 8

October 3, 2008

Advanced Packaging Magazine October Issue on 3D Packaging

October 3, 2008

Vertical Circuits and Aptos Technology Sign Strategic Manufacturing Agreement

Scotts Valley, CA    August 4, 2008

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Scotts Valley, Ca    July 15, 2008

VERTICAL CIRCUITS INC. ANNOUNCED THE APPOINTMENT OF INGU YIN CHANG AS VP OF SALES AND MARKETING

SCOTTS VALLEY, CA    December 13, 2007

Shinko Electric Industries licenses Vertical Circuits’ 3D Interconnect Technology

Scotts Valley, CA    December 4, 2007

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