
Jetting Your Way to Fine-pitch 3D Interconnects
November 16, 2010
Optomec and Vertical Circuits Partner to Develop Ultra-Fine Pitch 3D Interconnect Solution
Albuquerque, New Mexico July 9, 2009
Vertical Circuits Inc. announces the addition of Bill Watkins and David Savage to its Board of Directors.
SCOTTS VALLEY, CA March 10, 2009
Micronews Issue 77 - Vertical Circuits & Disco partner to enable high density 3D packaging solution
February 26, 2009
3D Wafer Level Packages for Memory and Image Sensor Applications
Chip Scale Review, January 2009 February 5, 2009
Vertical Circuits and DISCO Corporation Partner to Enable High Density 3D Packaging Solution
Scotts Valley, CA January 28, 2009
Advancing Microelectronics
November/December 2008 December 30, 2008
Advanced Packaging Magazine, September Issue on Thin, Strong, Cheap: Improving 3D Chip Properties SEMICON West 2008 in Review Exhibitor Spotlight, Page 8
October 3, 2008
Advanced Packaging Magazine October Issue on 3D Packaging
October 3, 2008
Vertical Circuits and Aptos Technology Sign Strategic Manufacturing Agreement
Scotts Valley, CA August 4, 2008
Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology
Scotts Valley, Ca July 15, 2008
VERTICAL CIRCUITS INC. ANNOUNCED THE APPOINTMENT OF INGU YIN CHANG AS VP OF SALES AND MARKETING
SCOTTS VALLEY, CA December 13, 2007
Shinko Electric Industries licenses Vertical Circuits’ 3D Interconnect Technology
Scotts Valley, CA December 4, 2007
Back to News