Shinko Electric Industries licenses Vertical Circuits’ 3D Interconnect TechnologyScotts Valley, CA December 4, 2007Shinko Electric Industries licenses Vertical Circuits’ 3D Interconnect Technology SCOTTS VALLEY, CA, December 4, 2007 – Vertical Circuits Inc. (VCI), a leading supplier of advanced die level interconnect technology and intellectual property, today announced a long term license agreement with Shinko Electric Industries, enabling Shinko to utilize VCI’s patented Vertical Interconnect Pillar (VIP) technology to develop and produce next generation chip scale 3D packaging solutions. ”VCI’s low cost, low profile, high density stacking and interconnect capabilities, combined with our advanced IC packaging technology, manufacturing, logistics, and sales & marketing have created significant new opportunities for both companies in the future,” said Mitsuharu Shimizu, General Manager, Research & Development of Shinko . “VCI’s VIP technology provides us the near Thru Silicon Via (TSV), die level interconnect solution required to meet the high density package form factor for the integration of memory, ASIC, and RF functionality. The combination of these features is being driven extensively by portable consumer devices such as smart phones, music players, solid state drives and digital cameras. We found VCI’s technology particularly appealing because of its ability to seamlessly integrate into our existing manufacturing infrastructure”. Sunil Kaul, VCI’s President & CEO commented, “We are delighted to have signed this agreement with one of the world’s leading packaging companies. Japan leads the world in electronic system miniaturization and integration. This agreement demonstrates Shinko’s recognition that VCI’s 3D packaging technology offers the right performance, profile and cost necessary to develop enabling solutions for growing consumer electronics applications that demand ultra dense memory and mixed device solutions. We are pleased to enter into a relationship with this distinguished global IC package leader and look forward to ongoing collaboration between our two companies” About Shinko Electric Industries Shinko Electric Industries Co., Ltd. was founded in Nagano, Japan in 1946. Shinko is an all round manufacturer of semiconductor packages, notably lead frame and PLP (Plastic Laminated Package), and recognized as a leader in the industry. More information on Shinko is available on Shinko's web site: http://www.shinko.co.jp/english/index.html About Vertical Circuits, Inc. Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnects technology, products, services and intellectual property for the manufacture of low cost, ultra high-speed/high-density semiconductor components. www.verticalcircuits.com Contact Information: Yin Chang Vice President, Sales & Marketing 10 Victor Square Scotts Valley, CA 95066 U.S.A Tel: +1 831-438-3887 yin.chang@verticalcircuits.com |
