Vertical Circuits Inc. selects DEK and Creative equipment for High Volume ManufacturingScotts Valley, Ca. August 23, 2007Vertical Circuits Inc. selects DEK and Creative equipment for High Volume Manufacturing Scotts Valley, CA, -- August 23, 2007--Vertical Circuits Inc., a leading supplier of next generation 3D interconnect solutions, today announced strategic partnerships with DEK International and Creative Automation Company, industry leading suppliers of high-volume semiconductor manufacturing equipment, for the delivery of high-throughput, “off-the-shelf”, vertical interconnect manufacturing solutions to IC fabricators and sub-contractor packaging companies worldwide. Vertical Circuits wafer-level chip-stacking approach employs conductive polymer traces, or “vertical interconnect pillars”, to form the connections from chip to chip. Unlike traditional wire-bonded or Package-on-Package (PoP) technologies, the Vertical Circuits solution dramatically reduces the required bill of materials, including gold, and facilitates the use of high-speed polymer deposition equipment, such as Creative’s jet dispense and DEK’s stencil-printing technologies. “We are delighted to be partnered with equipment innovators such as DEK and Creative,” said Simon McElrea, Vertical Circuits’ Vice President of Product Development. “Their detailed knowledge of high-throughput/low-cost conductor deposition, and their established global footprint, has allowed us to enable much broader adoption of our technology into the existing manufacturing infrastructure. We continue to make rapid progress on our roadmap to deliver interconnect cycle-times up to 100 times faster than existing solutions.” Gary Helmers, Vice President of Creative’s Dispensing Division said “Creative Automation is pleased to be partnered with Vertical Circuits in the high volume scaling of the production process for their revolutionary technology. This is the perfect application for Creative Automation’s patented Piston Positive Displacement Pump. The Creative Automation pump delivers Digital Dispensing accuracy and control to an application that requires extremely accurate fluid volume and placement.” “We are excited to be a key partner in the scale-up of Vertical Circuits' 3D interconnect technology. DEK's goals of pioneering product innovation and enhancing customer productivity by leveraging our high accuracy mass imaging equipment fit perfectly with Vertical Circuits' business and technology model” said Neil MacRaild, General Manager DEK USA. DEK is the world’s leading provider of equipment and processes for the high accuracy mass imaging of electronic materials. Through the combined strength of machines, stencils and screens, consumables and process support products, DEK delivers total support for its customers’ materials deposition processes. About Vertical Circuits, Inc. Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect technology, products, services and intellectual property for the manufacture of low cost, ultra high-speed/high-density semiconductor components. |
