Same Size Die Applications » High performance DRAM memory » High density FLASH » Supports 2, 4, 8, 16, 32…high stacks » Typical Die Stack Heights    » 0.46mm high for 4-die stacks    » 0.84mm high for 8-die stacks    » 1.60mm high for 16-die stacks » True die size solution

Mixed Die SiP (System in Package) Integration » 2 or more mixed die » Mixed Technologies    » ASIC & Memory    » DSP & FLASH    » Analog + Digital » Reduced Size » Optimized Performance » Lower Pin Count

Packaging

» Vertical Circuits micropede ™ and Micro SiP are agnostic to packaging format or system architecture
» Can be utilized in standard package platforms or as standard modules

2-Same Size Die Stack	4-Same Size Die Stack	n-Same Size Die Stack
Mixed Die Stack		Eg. 8-Hi Flash Stack